Silicone-based gap fillers are used to fill air gaps between components, improving thermal conduction. Their flexibility and resilience allow them to conform to irregular surfaces, ensuring effective heat dissipation in electronic assemblies.
4.0 [ASTMD5470]
0.5~25 [ASTM D374]
I.M Technology
3 [ASTMD5470]
0.5~25 [ASTM D374]
I.M Technology
2.2 [ASTMD5470]
0.5~25 [ASTM D374]
I.M Technology
1.6 [ASTMD5470]
0.5~25 [ASTM D374]
I.M Technology
1.7 [ASTMD5470]
0.5~25 [ASTM D374]
I.M Technology
14 [ASTMD5470]
1.0~3.0 [ASTM D374]
I.M Technology
14 [ASTMD5470]
0.5~2.0 [ASTM D374]
I.M Technology
12 [ASTMD5470]
0.5~3.0 [ASTM D374]
I.M Technology
10 [ASTMD5470]
0.25~5.0 [ASTM D374]
I.M Technology
7 [ASTMD5470]
0.3~3.0 [ASTM D374]
I.M Technology
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