Thermal grease, putty, and adhesives enhance heat transfer between surfaces, filling microscopic gaps that hinder thermal conduction. These materials are essential for ensuring optimal performance in high-power electronic applications.
7.0 [ASTMD5470]
n.a.
I.M Technology
5.1 [ASTMD5470]
n.a.
I.M Technology
4.0 [ASTMD5470]
n.a.
I.M Technology
4.5 [ASTMD5470]
n.a.
I.M Technology
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