thermal-conductive-materials, silicone-based-gap-fillers, IMFH-3500

IMFH-3500

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IMFH-3500

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Brief Description: High ceramic powder filler content and 30um thin glass fiber composites. Low thermal contact resistance. Exceptional thermal performance at lower application pressures (20psi-400psi). Recommended for use in parts need insulation eg. TO220/TO3P
Exterior color: Green [Visual]
Carrier material: Fiberglass
Thermal Conductivity (W/m-k): 3.5 [ASTMD5470]
Specific Gravity (g/cm3): 2.9 [ASTM D792]
Product Thickness (mm): 0.2 [ASTM D374]
Extension rate (%): <10 [ASTMD412]
Tensile Strength (psi): >300 [ASTMD412]
Hardness (Shore A): 80 [ASTM D2240]
Volume Resistivity (Ω•cm): >1013 [ASTMD257]
Continuous Use Temperature (℃): -50 ~ 220
Dielectric Constant (Unit=1): 8 [ASTMD150]
Thermal Impedance @0.5mm (°C-in²/W): 0.2 [ASTM D5470]
Breakdown Voltage (KV/mm): >3.5 [ASTM D149]
Shelf Life: 1 year without back adhesive, 6 months with back adhesive.
Standard Packing: sheet 300*300mm [0.2mm] (MOQ 150PCS for 0.2mm]
Safety approvals: REACH/RoHS Compliant
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