Brief Description: SMD Fuse , Chip fuse
SMD Fuse , Chip fuse
Time - current features: Time-Lag (T)
Time-Lag (T)
Breaking capacity: 50A@32Vdc
50A@32Vdc
Operating temperature: -55°C ~ +150°C
-55°C ~ +150°C
Soldering Parameters: 260°C.≤10 sec (Wave Soldering), 300°C.≤2 sec (Hand Soldering)
260°C.≤10 sec (Wave Soldering), 300°C.≤2 sec (Hand Soldering)
Soldering Peak: 260°C, 10sec., 280°C, 5sec. (IEC 60068-20)
260°C, 10sec., 280°C, 5sec. (IEC 60068-20)
Storage Conditions/Humidity: +10°C—+60°C, relative humidity ≤75% yearly average, without dew, maximum 30 days at 95%
+10°C—+60°C, relative humidity ≤75% yearly average, without dew, maximum 30 days at 95%
Cross Ref. Manufacturers:
Littlefuse, Eaton, Bourns, Vishay, Schurter
